产品出厂规范 |

| 商品名称:半导体热电致冷芯片 型 号:TECl一一系列按致冷组件参数表所列 TESl一一系列包括微型及多级器件 包装要求:外包装箱为标准瓦楞出口纸箱,内装泡沫硬盒(不同型号数量不一)。 外箱尺寸为515*280*300mm 技术参数及检验要求: 1.每装运一批次必须随附检验报告。 2.本公司的检验合格报告,证明所检货物与为供货方提供的样品的参数一致。 本公司的详细检验项目如下: (1)外观检验,包括:a.轻缺陷:表面及边缘的缺损及不规则: b.轻缺陷:表面孔状缺陷; c.轻缺陷:瓷板面及导线有污渍: d.重缺陷:外型的不完整,如断裂或有细微裂纹。 (2)参数及尺寸检验:a.陶瓷尺寸规格:按客户要求.型号与致冷器件参数表一致: b.阻抗规格:同上: c.负载电流规格:在额定电压情况下,与参数表一致: d.每一致冷片必须带有两根引线,一根为红色.一根为黑色,长度按客户要求。 引线位置为:致冷面朝上,引线朝下本公司产品平均质量水平AQL值为1.5。
Product standards Item: I thermoelectric module Model: TEC1 series: refer to thermoelectric Module specification Table TES1 series includes mini type and multistage units Package: Outer package: corrugated export case Inter package: hard foam case (Various quantity to each type) Outer size: 515*280* 330mm Technical reference and check requirement 10ne quality check report attached to each batch 2 the quality check pass report testifies that the product is of the equal reference to the samples. Content of qual ity check: (1)Appearance: a. Light defect: and irregularity of surface and edges; b. Light defect: hole like defect on surface; c. Light defect: sewage on ceramic plate or leads; d. Heavy defects: lace of black heat shrinkable tube on the connecting terminal of the TE module. (2)Check of reference and size: a. Standards of ceramic part: in accordance with client requirement. b. Standards of resistance: in accordance with client requirement. c. Standards of loading current: in accordance with specification table in the range of rated voltage. d. Position of leads: when cold surface is upward, the leads are downward. Average quality level (AQL)of our products is 1.5. |